M5Stamp ESP32S3 Module
M5Stamp ESP32S3 Module
M5Stamp ESP32S3 Module
M5Stamp ESP32S3 Module
M5Stamp ESP32S3 Module
M5Stamp ESP32S3 Module
M5Stamp ESP32S3 Module
M5Stamp ESP32S3 Module
M5Stamp ESP32S3 Module
M5Stamp ESP32S3 Module
M5Stamp ESP32S3 Module
M5Stamp ESP32S3 Module
M5Stamp ESP32S3 Module
M5Stamp ESP32S3 Module
M5Stamp ESP32S3 Module
M5Stamp ESP32S3 Module
M5Stamp ESP32S3 Module
M5Stamp ESP32S3 Module
M5Stamp ESP32S3 Module
M5Stamp ESP32S3 Module

M5Stamp ESP32S3 Module

M5StackSKU: RB-Mst-332
Manufacturer #: S007
Price  :
€11,14

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On Demand See due date

This is an On Demand item and is not normally stocked. We will order it for you along with our next purchase from the supplier.

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Description

  • M5Stamp ESP32S3 Module
  • Powerful ESP32-S3FN8 MCU for versatile IoT projects
  • Compact size for seamless integration
  • 8MB Flash and 2.4G 3D antenna for enhanced connectivity
  • Wide range of interfaces, including touch sensor and GPIO
  • Easy setup with included accessories and user manual

The M5Stamp ESP32S3 Module offers a powerful and versatile solution for IoT projects, featuring an ESP32-S3FN8 MCU, 8MB Flash, and a 2.4G 3D antenna.

With a wide range of interfaces, including touch sensor, SPI, UART, and GPIO, this compact module ensures seamless connectivity and adaptability. The package includes essential accessories and a user manual for easy setup.

  • 1x M5Stamp ESP32S3 Module
  • 1x HY2.0-4P Terminal
  • 1x 2.54-9P Header
  • 1x 2.54-6P Header
  • 1x Hex Key
  • 1x User Manual
  • 26 x 18 x 5 mm
  • MCU: ESP32-S3FN8
  • DCDC: Highly integrated MUN3CAD01-SC
  • Flash: 8 MB
  • Input voltage: 5 V
  • Interactive: Programmable physical buttons x 1, programmable RGB LED (WS2812B-2020) x 1
  • Antenna type: 2.4G 3D antenna
  • Module resource interface: Touch sensor, SD/SDIO/MMC master controller, SPI, SDIO/SPI slave controller, EMAC, motor PWM, LED PWM, UART, I2C, I2S, GPIO, pulse counter
  • IO interface x23: G0/G1/G2/G3/G4/G5/G6/G7/G8/G9/G10/G11/G12/G13/G14/G15/G39/G40/G41/G42/G43/G44/G46
  • Connection method: SMT/DIP (pitch 2.54 mm and 1.27 mm)/Jump Wire
  • IO interface spacing: 2.54 mm and 1.27 mm
  • Operating temperature: 0 to 4 0°C

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